Intel appoints Seok-Hee Lee as EVP for Foundry’s Advanced Packaging, enhancing capabilities for AI and high-performance computing systems.
Intel has hired Seok-Hee Lee as EVP of its Foundry’s Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO.
Intel Foundry Gets SK Hynix’s Ex-CEO, Seok-Hee Lee, Bringing Years of Exp… [3157 chars]
Source: Wccftech | Published: 2026-06-18T22:10:09Z
Credit: Wccftech
