A chip that produces microscopic “earthquakes” could change smartphone design, allowing manufacturers to shrink internal components while boosting signal handling and data speeds using surface acoustic wave technology.
Researchers from the University of Colorado Boulder, University of Arizona, and Sandia National Laboratories have developed a new device that generates controlled vibrations on the surface of a microchip. These waves could help future smartphones bec… [2208 chars]
Source: Digital Trends | Published: 2026-01-15T23:30:10Z
Credit: Digital Trends
