After employing Heat Pass Block technology on the Exynos 2600, Samsung is reportedly developing a new packaging to further reduce temperatures
Samsung is no stranger to introducing new packaging technologies for its Exynos lineup of chipsets that help enable improved performance, efficiency, and lowered thermals. The company started off by bringing ‘Fan-out Wafer Level Packaging’ (FOWLP) to… [1967 chars]
Source: Wccftech | Published: 2025-12-30T14:54:19Z
Credit: Wccftech
