Home / General / iPhone 18’s New Chipset Packaging Rumored To Improve Heat Dissipation, Enabling Better Sustained Performance Compared To The iPhone 17 Lineup

iPhone 18’s New Chipset Packaging Rumored To Improve Heat Dissipation, Enabling Better Sustained Performance Compared To The iPhone 17 Lineup

Apple is rumored to switch to a new chipset packaging for the iPhone 18 family, with a tipster stating that this technology will improve heat dissipation

How We Rate Rumors
0-20%: Unlikely – Lacks credible sources
21-40%: Questionable – Some concerns remain
41-60%: Plausible – Reasonable evidence
61-80%: Probable – Strong evidence
81-100%: Highly Likely – Multiple reliable sources
RUMOR ASSESSMENT
60%… [2637 chars]

Source: Wccftech | Published: 2025-12-14T12:47:06Z

Credit: Wccftech

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