Bespoke ASICs and server chips from Apple and Broadcom are now expected to use Intel’s EMIB packaging technology in 2028.
It is widely known now that Apple is designing its bespoke server chip in collaboration with Broadcom. While the chip is expected to leverage TSMC’s fabs for actual production, a new tidbit suggests Apple might rope in Intel for back-end packaging.
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Source: Wccftech | Published: 2025-12-18T13:14:28Z
Credit: Wccftech
