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Intel taps industry veteran Seok-Hee Lee to lead foundry packaging push

Intel on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens ​focus on its advanced packaging business.

June 18 (Reuters) – Intel (INTC.O), opens new tab on Thursday named Seok-Hee Lee executive vice president of its contract chip-manufacturing division as it sharpens ​focus on its advanced packaging business.
The American chipmaker ‌has been trying to… [1486 chars]

Source: Reuters | Published: 2026-06-18T22:01:02Z

Credit: Reuters

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