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Intel Showcases Industry’s First “Glass Core” Substrates With EMIB Advanced Packaging, Acting as a Key Enabler For Next-Generation AI Chips

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January 22, 2026 6:21 pm

Intel’s plans to integrate glass substrates into packaging aren’t set to phase out just yet, as the company showcases a key innovation.

Intel’s plans to integrate glass substrates into advanced packaging technologies aren’t set to phase out just yet, as the company showcases a key innovation.
Intel’s Newest EMIB + Glass Substrate Core Technology Allows a Multi-Chiplet GPU Configurati… [2486 chars]

Source: Wccftech | Published: 2026-01-22T18:21:52Z

Credit: Wccftech